| NO | Process | Item | Technical Indicators |
1 | Laminaties Cutting | Laminate | CEM-1,CEM-3,FR-4,Rogers,Taconic |
Thickness | 0.2-4.0mm | ||
Working Panel Size | 1200*620mm max | ||
Base copper Thickness | 1/0-4/4OZ | ||
2 | Inner Dry Film | Inner Core thickness | 0.075mm（exclude copper） |
Conductor Width/spacing min | 0.076/0.076mm | ||
Inter layer Alignment | 4L: ±0.075mm 6L:±0.1mm ≥8L=±0.127mm | ||
Layer | 4L-14L（15-16L researching） | ||
Board Thickness Tolerance | ≥1.0mm±10% ≤1.0mm±0.1mm | ||
3 | Drilling | Drilling Diameter | ≥0.2mm |
Min slot diameter size | ≥0.6mm | ||
Hole Dia Tolerance | PTH:±0.076mm,NPTH:±0.05mm,Slot:±0.1mm | ||
Hole's Location Tolerance | ±0.076mm | ||
Drilling countersinks depth tolerance | ±0.18mm | ||
4 | PTH+Panel plating | Hole Wall Copper Thickness | ≥5-8um |
Uniformity | ≥90% | ||
Aspect Ratio | 8∶1 | ||
5 | Outer dry film | Conductor Width /Spacing | 0.1/0.1mm min |
Alignment | ±0.076mm | ||
6 | Impedance control | Tolerance | ±10% |
7 | Pattern Plating | Hole Wall Copper Thickness | ≥20um |
Uniformity | ≥90% | ||
Aspect Ratio | 8∶1 | ||
Finished Copper Thickness | 1OZ-5OZ | ||
8 | Etching | Etch factor | ≥1.5-2.0 |
9 | Solder Mask | Thickness | 10-38.1um |
Solder Mask Bridge | 0.1mm | ||
Alignment | ±0.076mm | ||
Plug Hole Dia | 0.25-0.5mm | ||
10 | Legend | Legend High/Width | 0.76/0.15mm min |
| Min.contraposition tolerance | ±0.15mm | ||
| Peelable mask plug hole | 0.8- 6.0mm | ||
| Min Space Of carbon | ≥0.4mm | ||
| 11 | Hot Air Level | Tin Thickness | 1-40um |
| 12 | ENIG | Nickel Thickness | ≥120-200u＂ |
| Gold Thickness | 1-5u＂ | ||
| 13 | OSP | Thickness of OSP | 0.2-0.5um |
| Minimum board size | 80x80mm | ||
| 14 | Immersion Tin | Minimum board size | 100mm*100mm |
| Tin Thickness | ≥0.8um | ||
| Don’t run print peelable mask or plug hole process, which is need to be baked process ,after I/T | |||
| 15 | Immersion Silver | Minimum board size | 100mm*100mm |
| Silver Thickness | 6-20μ″ | ||
| Don’t run print peelable mask or plug hole process, which is need to be baked process ,after I/S | |||
| 16 | Gold Finger | Gold Thickness | ≥3-50u＂ |
| 17 | Routing | Tolerance of Dimension | ±0.1mm min |
| Slot Size | 0.8mm min | ||
| Minimum distance from conductor to routing edge | ≥0.254mm | ||
| Minimum distance from hole edge to routing edge | ≥0.254mm | ||
| Routing countersinks depth tolerance | ±0.18mm | ||
| Cutter Diameter | 0.8-2.4mm | ||
| 18 | Punching | Tolerance of Dimension | ±0.1mm min |
| Minimum distance from punching edge to board edge | 0.4mm min | ||
| Minimum distance from punching hole to board edge | is board thickness | ||
| Minimum distance from conductor to punching edge | 0.5mm min | ||
| Minimum punching size | 1.0*1.5mm min | ||
| Minimum distance between adjacent punching cuts | 2.0mm min | ||
| The maximum thickness of punching boards | 2.0mm max | ||
| 19 | V-CUT | V-CUT Dimension | 80mm*80mm min |
| Angle | 20°30°45°:+/-5° | ||
| Remain Thickness Tolerance | ±0.1mm | ||
| Maximum scoring alignment tolerance on both sides | ±0.1mm | ||
| 20 | Bevel | Beveling Dimension | 30-300mm |
| 21 | ET | Testing Voltage | 250V |
| Max.Dimension | 1200*540mm max | ||
| 22 | Rinsing | Min Panel Size | 75mm*75mm min |
| 23 | FQC | Warp＆twist | IPC-600G（2 standard）single max1.0%,double max0.75%,multilayer max0.75%. |
| Packing | Vacuum Packing | ||
| 24 | PCB | Process capacity | Rogers, Taconic, Teflon material Single side, Double side and Multilayers Multilayer mixed with Rogers and FR4 |