NO

Item

Technical Indicators

1

Plate Type

AL / Cu/ Fe

2

Surface Treatment

ENIG/HASL/OSP/Immersion Silver

3

Layers

1-8 Layers

4

Max.Board Size

585mm×1185mm

5

Min.Board Size

3mm×10mm

6

Board Thickness

0.4-6.0mm

7

Copper Thickness

1OZ-6OZ

8

Min.Line Width

0.1mm

9

Min.Space

0.1mm

10

Min.Hole Size

0.5mm

11

PTH Hole Dia.Tolerance

±0.05mm (GB/T 1804-f)

12

Non PTH Hole Dia.Tolerance

±0.05mm (GB/T 1804-f)

13

Hole Position Tolerance

±0.05mm (GB/T 1804-f)

14

Outline Tolerance

±0.05-0.1mm (GB/T 1804-f)

15

V-CUT

30°

16

V-CUT Size

5mm×1200mm

17

V-CUT Board Thickness

0.6-3mm

18

V-CUT Verticality

≤0.1mm

19

Min.BGA PAD

0.35mm

20

Soldemask Layer Min.Bridge width

0.1mm

21

Soldemask film Min.Thickness

0.1mm

22

Insulation Resistance

10 Ω Normal

23

Peel-off Strength

2.2N/mm

24

Solder float

260℃ 3min

25

E-test Voltage

50-250V

26

Insulator Thermal conductivity

1W-8W/M.K

27

Direct thermal conection Thermal conductivity

AL 250W/M.K, Cu400W/M.K

28

Warp or twist

≤0.5%

29

Flammability

FV-0