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Location： Capacity Intro |
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| Layers |
2-22 Layers |
| Max.Board Size |
23inch * 35 inch |
| Board Thickness |
0.4-6.0 mm |
| Min.Line Width |
0.10 mm |
| Min.Space |
0.10 mm |
| Min.Hole Size |
0.15 mm |
| PTH Wall Thickness |
>0.025 mm |
| PTH Hole Dia.Tolerance |
±0.05 mm |
| Non PTH Hole Dia.Tolerance |
±0.05 mm |
| Hole Position Deviation |
±0.076 mm |
| Outline Tolerance |
±0.1 mm |
| V-cut |
30°/45°/60° |
| Min.BGA PAD |
14 mil |
| Impedance control PCB |
≤50Ω ±5Ω |
| ＞50Ω ±10% |
| Soldemask Layer Min.Bridge width |
5mil |
| Soldemask film Min.Thickness |
10mil |
| Insulation Resistance |
1012Ω Normal |
| Peel-off Strength |
1.4 N/mm |
| Soldemask Abrasion |
>5 H |
| Soldexability Test |
260℃20 second |
| E-test Voltage |
50-250V |
| Permitivity |
ε=2.1~10.0 |
| Volume resistance |
1014Ω-m,ASTM D257,IEC60093 | |
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