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当前位置： 生产能力 |
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| 层数 |
Layers |
2-22(层)Layers |
| 最大加工面积 |
Max.Board Size |
23inch * 35inch |
| 板厚 |
Board Thickness |
0.4-6.0mm |
| 最小线宽 |
Min.Line Width |
0.10mm |
| 最小间距 |
Min.Space |
0.10mm |
| 最小孔径 |
Min.Hole Size |
0.15mm |
| 孔壁铜厚 |
PTH Wall Thickness |
>0.025mm |
| 金属化孔径公差 |
PTH Hole Dia.Tolerance |
±0.05mm |
| 非金属化孔径公差 |
Non PTH Hole Dia.Tolerance |
±0.05mm |
| 孔位公差 |
Hole Position Deviation |
±0.076mm |
| 外形尺寸公差 |
Outline Tolerance |
±0.1mm |
| 开槽 |
V-cut |
30°/45°/60° |
| 最小BGA焊盘 |
Min.BGA PAD |
14mil |
| PCB交流阻抗控制 |
Impedance control PCB |
≤50Ω ±5Ω |
| ＞50Ω ±10% |
| 阻焊层最小桥宽 |
Soldemask Layer Min.Bridge width |
5mil |
| 阻焊膜最小厚宽 |
Soldemask film Min.Thickness |
10mil |
| 绝缘电阻 |
Insulation Resistance |
1012Ω(常态)Normal |
| 抗剥强度 |
Peel-off Strength |
1.4N/mm |
| 阻焊剂硬度 |
Soldemask Abrasion |
>5H |
| 热衡击测试 |
Soldexability Test |
260℃20(秒)second |
| 通断测试电压 |
E-test Voltage |
50-250V |
| 介质常数 |
Permitivity |
ε=2.1~10.0 |
| 体积电阻 |
Volume resistance |
1014Ω-m,ASTM D257,IEC60093 | |
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